Cleaning Technique Using High-Speed Steam-Water Mixed Spray
Masao Watanabe, Toshiyuki Sanada, Atsushi Hayashida, Yoichi Isago |
p43 |
|
Pattern Collapse and Particle Removal Forces of Interest to Semiconductor Fabrication Process
Tae Gon Kim, Kurt Wostyn, Jin Goo Park, Paul W. Mertens, Ahmed A. Busnaina |
p47 |
|
Applications of Electrostatic Spray Techniques to Surface Cleaning
Ken Finster, Robert Small, Andrea Belz, John Mahoney, Julius Perel, Jian Gong |
p51 |
|
Analyzing the Collapse Force of Narrow Lines Measured by Lateral Force AFM Using an Analytical Mechanical Model
Kurt Wostyn, Tae Gon Kim, Paul W. Mertens, Jin Goo Park |
p55 |
|
Reduced Particle Removal Efficiency Upon Wafer Storage
D. Martin Knotter, Romuald Roucou, Rémi Peyrin |
p61 |
|
Local Distribution of Particles Deposited on Patterned Surfaces
Faisal Wali, D. Martin Knotter, Twan Bearda, Paul W. Mertens |
p65 |
|
Particle Retention Mechanism of Filter in High Temperature Chemical
Takuya Nagafuchi, Koji Chiba, Isamu Funahashi, Minako Inukai, Hiroaki Yamada, Kaori Umezawa, Hiroshi Tomita |
p69 |
|
Improving Process Control for Copper Electroplating through Filter Membrane Optimization
Ai Wen Wu, Gregg Cornner, Vinay Prabhaker |
p73 |
|
Particle – Wafer Interactions in Semiaqueous Silicon Cleaning Systems
Lukasz Hupka, Jakub Nalaskowski, Nishant Sinha, Joseph N. Greeley, Zak Clark, Hao Du, William P. Johnson, Jan D. Miller |
p77 |
|
Drying of High Aspect Ratio Structures: A Comparison of Drying Techniques via Electrical Stiction Analysis
Antoine Pacco, Masayuki Wada, Twan Bearda, Paul W. Mertens |
p87 |
