II: Ultra-Shallow Junction Cleaning: Methodologies for Process and Chemistry Optimization
Aseem K. Srivastava, Ke Ping Han, Mike S. Ameen, Ivan L. Berry, Stu Rounds |
p133 |
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Effect of Dopants on the Dissolution Behavior of Silicon Substrates in HF-Based Cleaning Solutions
Salima Abu Jeriban, Ivette Guiot, Luc Bacherius, Joris Proost, Erik Sleeckx, Rita Vos, Paul W. Mertens |
p139 |
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The Effect of Various Process Induced Damages on Wet Etching Rate Difference
Hyo Geun Yoon, Sang Hyun Lee, Woo Jin Kim, Geun Min Choi, Young Wook Song |
p143 |
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How Bubbles (Can) Clean
Claus Dieter Ohl, Rory Dijkink, Manish Arora, Detlef Lohse |
p151 |
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Aging Phenomena in the Removal of Nano-Particles from Si Wafers
Guy Vereecke, J. Veltens, Kai Dong Xu, Atsuro Eitoku, Kenichi Sano, Sophia Arnauts, Karine Kenis, James Snow, Chris Vinckier, Paul W. Mertens |
p155 |
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Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP
Yi Koan Hong, Young Jae Kang, Jin Goo Park, Sang Yeob Han, Seong Kyu Yun, Bo Un Yoon, Chang Ki Hong |
p159 |
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Particle-Substrate Interaction Forces in a Non-Polar Liquid
Francesca Barbagini, Wim Fyen, Jan Van Hoeymissen, Paul W. Mertens, Jan Fransaer |
p165 |
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Interaction Forces between Oxide and Silica-Modified Terpolymer Abrasive and their Impact on CMP and Post-CMP
Silvia Armini, Ruslan Burtovyy, Igor Luzinov, Caroline M. Whelan, Karen Maex, Mansour Moinpour |
p169 |
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Particle Deposition and Removal from Ge Wafers
Sonja Sioncke, Marcel Lux, Wim Fyen, Marc Meuris, Paul W. Mertens, Antoon Theuwis |
p173 |
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A Study of a Single-Wafer Process in Metal Contact Hole Cleaning
Jae Yong Park, Jong Kook Song, Han Mil Kim, Hee Kang Cho, Tae Gyun Kim, Bong Ho Moon, Eun Su Rho, Leo Archer, Won Ho Cho |
p177 |
