Nitride Strip: Phosphoric Acid Bath-Life above 100 Hours
C. Willis |
p127 |
|
Wet Metal Etching for Ti/Co Self-Aligned Silicides
S. O'Brien |
p131 |
|
Post-Titanium-Salicide Cleaning with Spray Technology
John Diedrick, A. Mauri, V. Nguyen |
p135 |
|
XPS Study of the Cleaning Efficiency by Ozone Processes of the Protective Films Formed by Reactive Ion Etching of Co and Ti Silicide
Thierry Conard, Stefan de Gendt, Mikhail R. Baklanov, Rita Vos, Marc M. Heyns, W. Vandervorst |
p139 |
|
Plasma Etch Residue and Photoresist Removal Utilizing Environmentally Benign Process Chemicals
W. Kleemeier, V. Leon, S. Graham |
p143 |
|
Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning
Y.B. Kim, B. Beckx, Serge Vanhaelemeersch, W. Vandervorst |
p153 |
|
Dynamics of Mass Transfer on a Wafer Surface in Ozonated-Water Processing for Photoresist Removal
Natraj Narayanswami, S. Nelson |
p157 |
|
Construction of the Distribution System for Ozonized Water Used in the Wet Cleaning of Si Wafer Surface
Osamu Nakamura, M. Yoshida, Yasuharu Shirai, Masakazu Nagase, Michio Kitano, M. Gozyuki, Yukio Hashimoto, Tadahiro Ohmi |
p161 |
|
A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry
Stefan de Gendt, P. Snee, I. Cornelissen, Marcel Lux, Rita Vos, Paul W. Mertens, D. Martin Knotter, M.M. Meuris, Marc M. Heyns |
p165 |
|
Post CMP Cleaning Using a Novel HF Compatible High Power Magasonic Tank
F. Tardif, T. Lardin, I. Constant, M. Fayolle, Pieter Boelen, C. Cowache, Ismail Kashkoush, R. Novak |
p169 |
