Strain Induced Grain Boundary Premelting due to Heavy Pile-Up of Screw Dislocations in Deformed Copper Bicrystals
F. Inoko, Tatsuya Okada, Takafumi Yoshikawa |
p175 |
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Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'
N. Balandina, Boris S. Bokstein, A. Ostrovsky |
p181 |
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Influence of Precipitates on the Grain Boundary Diffusion: A Perturbative Approach
N.S. Khader, D.E. Mekki, R.J. Tarento |
p191 |
|
The Manifestations of the Diffusion-Coefficient Distribution Functions of the Grain Boundaries in W and Au Polycrystals
M.I. Kurkin, S.M. Klotsman, A.N. Timofeyev, V.V. Dyakin |
p199 |
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The Study of the Diffusion of 57Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations
N.I. Timofeev, S.M. Klotsman, M.I. Kurkin, V.V. Dyakin, V.K. Rudenko |
p205 |
|
Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System
Sergey I. Sidorenko, S.M. Voloshko, M.A. Vasiliev |
p215 |
|
Exact Solution of Triple Junction Diffusion Problem
V.A. Ivanov, Anatoly S. Ostrovsky, A. Petelin, S. Peteline |
p223 |
|
Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation
N.M. Amirkhanov, Rinat K. Islamgaliev |
p229 |
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Growth and Healing of Voids at Grain Boundary during High Temperature Creep
V.S. Gostomelskii |
p235 |
|
Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds
Sergiy V. Divinski, Leonid N. Larikov |
p243 |
