Development of New Device for Form-Grinding and Research on the Profile-Accuracy
Qiu Sheng Yan, Ling Ye Kong, N.Q. Wu, Shao Bo Chen, Zi Qiang Zhang, Zhi Dan Zheng
|
p3 |
Adaptive Table-Motion Control of a Surface Grinding Machine Using an AE Sensor
Akinori Yui, Shigeki Okuyama, Takayuki Kitajima
|
p9 |
An Adaptive Control of Machine Table Reciprocation Using a Hydrophone - A Method for Improving the System Efficiency and Reliability -
Shigeki Okuyama, Makoto Hayashi, Akinori Yui, Takayuki Kitajima
|
p15 |
Abrasive Technology of Single-Crystal Diamond by Diamond Abrasive Wheel
Y. Ma, Z.F. Lou
|
p21 |
Effects of TiH2 on the Properties of Fe-Based Diamond Composites
Qiu Lian Dai, Xi Peng Xu
|
p27 |
Effect of Ultrasonic Elliptic Vibration on Friction between Shoe and Workpiece in Ultrasonic Elliptic-Vibration Shoe Centerless Grinding
Yong Bo Wu, Y. Fan, T. Tachibana, M. Kato
|
p33 |
Eco- and Energy-Efficient Grinding Processes
Berend Denkena, M. Reichstein, Niklas Kramer, J. Jacobsen, M. Jung
|
p39 |
Study on Ultrasonic Vibration Grinding Character of Nano ZrO2 Ceramics
Bo Zhao, X.H. Zhang, C.S. Liu, Feng Jiao, Xun Sheng Zhu
|
p45 |
New Compensation Grinding of Axisymmetric Aspherical Lenses with High NA Value
Nobuhito Yoshihara, Tsunemoto Kuriyagawa
|
p51 |
A New Diamond Wheel Containing Boron Doped Diamond Abrasives Enabling Electrically Conductive Cutting Edge and High Thermal Stability
Kiyoshi Suzuki, Manabu Iwai, Shinichi Ninomiya, Keizo Takeuchi, Katsutoshi Tanaka, Y. Tanaka, Tetsutaro Uematsu
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p57 |