Progress of Research in Slicing Technology of Large-Scale Silicon Wafers
Li Gang Zhao, Dun Wen Zuo, Yu Li Sun |
p1 |
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The Analysis on Movement of the Charged Particles in a Magnetic-Electrochemical Compound Polishing
Li Min Shi, Yu Quan Chen, Er Liang Liu |
p6 |
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Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon
Ming Hai Wang, Ze Sheng Lu |
p11 |
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Initiation and Propagation Laws of Glass Cracks in Specimens under the Action of Cylindric Indenter Subjected to Normal Load
Zhen Ping Wan, Wen Jun Deng, Yong Tang |
p17 |
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Large Plastic Deformation and Ultra-Fine Grained Structures Generated by Machining
Wen Jun Deng, Wei Xia, Yong Li, Zhen Ping Wan, Yong Tang |
p21 |
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Mechanism of Chip Deformation in Orthogonal Cutting the Wheel Steel
Kai Xue, Xiang Ming Xu, Gang Liu, Ming Chen |
p26 |
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The Influence of Tool Edge Radius on Size Effect in Orthogonal Micro-Cutting Process of 7050-T7451 Aluminum Alloy
Jun Zhou, Jian Feng Li, Jie Sun, Zhi Ping Xu |
p31 |
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Behaviors of Suspended Powder in Powder Mixed EDM
Yuan Gang Wang, Fu Ling Zhao, Yu Liu |
p36 |
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Study on Mechanism of Vibration Cutting
Fu Qiang Tong, Yong Zhang, Fei Hu Zhang, Jing Yu Lu, Li Zhi Gu, Ya Chun Chen |
p42 |
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Study on the Polishing Mechanism of Low Temperature Co-Fired Ceramic for Microsystem Application
Ji Jun Zhu, Ju Long Yuan, Simon S. Ang |
p47 |
