Galvanic Corrosion of Stacked Metal Gate Electrodes during Cleaning in HF Solutions
Sylvain Garaud, Rita Vos, Denis Shamiryan, Vasile Paraschiv, Paul W. Mertens, Jan Fransaer, Stefan De Gendt |
p87 |
|
The Dynamic Aspects of Electrochemical Reaction Cells in Selectively Inducing Defects on Silicon Surface
Lie Yi Sheng, Johan De Greve, Eddy De Backer, Philippe Verpoort, Jan Ackaert, Filip Bauwens |
p91 |
|
Wafer Cleaning Using Supercritical CO2 in Semiconductor and Nanoelectronic Device Fabrication
Koichiro Saga, Takeshi Hattori |
p97 |
|
All-Wet Stripping of FEOL Photoresist Using Mixtures of Sulphuric Acid
Enrico Bellandi, Mauro Alessandri, Stefan Detterbeck, Sally Ann Henry, Leo Archer, Thomas Hellweg, Michael Kagerer, Ladislaus Brilz |
p105 |
|
All Wet Stripping of Implanted Photoresist
Kurt K. Christenson, Jeffery W. Butterbaugh, Thomas J. Wagener, Nam Pyo Lee, Brent Schwab, Michael Fussy, John Diedrick |
p109 |
|
Study of a Metal Gate and Silicon Selective “Dry Ash Only” Process for Combined Extension and Halo Implanted Photo Resist
G. Mannaert, Mikhail R. Baklanov, D. Goossens, Johann Vertommen, Werner Boullart |
p113 |
|
High Dose Implant Stripping and Residue Removal with Sequential Plasma and Vacuum Aerosol Processes
Karen A. Reinhardt, Khalid Makhamreh, George Tannous |
p117 |
|
Confined Chemical Cleaning: A Novel Concept Evaluated for Front End of Line Applications
Ingrid Vos, Stefan Peeters, Rita Verbeeck, Werner Boullart, Johann Vertommen |
p121 |
|
Impact of RF Oxygen Plasma on Thermal Oxide Etch-Rate
Enrico Bellandi, Annamaria Votta, Francesco Pipia, Matteo Ferrerio, Cinzia De Marco, Simone Alba, Mauro Alessandri |
p125 |
|
I: Ultra-Shallow Junction Cleaning: Metrology for Evaluating Dopant Loss and Substrate Erosion
Mike S. Ameen, Aseem K. Srivastava, Ivan L. Berry |
p129 |
