Dependence of Thermal-Cycling-Induced Deformation on Passivation Morphology in Plastic-Encapsulated Microelectronic Devices
Seong Min Lee |
p1 |
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Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test
Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung |
p5 |
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Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines
Min Seung Yoon, Oh Han Kim, Young Chang Joo, Young Bae Park |
p9 |
|
Electrical Properties of ZrO2 Capacitor Dielectrics Deposited by rf Magnetron Sputtering
Chong Mu Lee, Keun Bin Yim, Anna Park, Ho Jin Kim |
p13 |
|
Role of SrRuO3 Buffer Layers in Enhancing Resistance Changing of Pr0.7Ca0.3MnO3 Films
Seung Woo Han, Kyoung Wan Park, Jung Hyun Sok |
p17 |
|
Electrical Switching Characteristics of Nitrogen Doped Ge2Sb2Te5 Based Phase Change Random Access Memory Cell
Myoung Sub Kim, Jin Hyung Jun, Jin Ho Oh, Hyeong Joon Kim, Jae Sung Roh, Suk Kyoung Hong, Doo Jin Choi |
p21 |
|
Bump Formation and Flip Chip Processes for RF System-on-Packages
Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh |
p25 |
|
Dislocation-Free Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Embedded Flash Memory
Nam Hoon Kim, Hae Young Yoo, Eui Goo Chang |
p29 |
|
Dependency of Electrical Characteristics on Au Nano-Crystal Size for Non-Volatile Memory Fabricated with Au Nano-Crystal Embedded in PVK(Poly(N-Vinylcarbazole)) Layer
Chang Kyu Lee, Jong Sung Kwon, In Chul Na, Byung Il Han, Young Min Kim, Jea Gun Park |
p33 |
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Thermal Stress Model for Phase Change Random Access Memory
Sung Soon Kim, Jun Hyun Bae, Woo Hyuck Do, Kyun Ho Lee, Young Tae Kim, Young Kwan Park, Jeong Taek Kong, Hong Lim Lee |
p37 |
