Ultra Clean Processing of Silicon Surfaces VII (Table of Contents)

Occurrence of Arsenic-Based Defects and Techniques for Their Elimination Felicia Goh, Christopher Lim, Vincent Sih, Zainab Ismail, Simon Y.M. Chooi	p87
Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks M. Claes, Vasile Paraschiv, S. Beckx, M. Demand, W. Deweerd, Sylvain Garaud, H. Kraus, Rita Vos, James Snow, Werner Boullart, Stefan De Gendt	p93
HF Based Solutions for HfO₂ Removal; Effect of pH and Temperature on HfO₂: SiO₂ Etch Selectivity Vasile Paraschiv, M. Claes, Mikhail R. Baklanov, Werner Boullart, Stefan De Gendt, Serge Vanhaelemeersch	p97
Selective Si₃N₄ Etch in Single Wafer Application D. Martin Knotter, Nigel Stewart, Ian Sharp	p103
Etch Rate Depth Profiling by Single Wafer Etching Equipment Enrico Bellandi, Alice C. Elbaz, Rosella Piagge, Francesco Pipia, Mauro Alessandri	p107
Novel Chemical Etching to Correct Film Thickness Distributions Hajime Ugajin, Hayato Iwamoto, Kei Kinoshita	p111
Etching of Silicon Oxide Films in Supercritical Carbon Dioxide Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori, Kenji Yamada, Tomoyuki Azuma	p115
Challenges of Finer Particle Detection on Bulk-Silicon and SOI Wafers Takeshi Hattori, Akira Okamoto, Hitoshi Kuniyasu	p121
The Impact of Backside Particles on the Limits of Optical Lithography Twan Bearda, Paul W. Mertens, Frank Holsteyns, Peter De Bisschop, René Compen, Aschwin van Meer, Marc M. Heyns	p129
Inspection Challenges at the 45nm Technology Node David Shortt, Lisa Cheung	p133

Papers of Title

Ultra Clean Processing of Silicon Surfaces VII

Table of Contents (86 papers, 10 per page listed)