In Situ Wafer Processing for Next Generation Devices
Ismail Kashkoush, Lewis Liu, Nick Yialamas, R. Novak |
p45 |
|
Organic Contamination Control in Silicon Surface Processing
Koichiro Saga, Takeshi Hattori |
p49 |
|
Application of UV/VIS-Spectroscopy for Determination of Complexing Agent Stability in APM and Like Mixtures Thereof
O. Doll, Bernd O. Kolbesen |
p55 |
|
Plasma Cleaning for W Polymetal Gate
Alex Kabansky, Harry Lee |
p59 |
|
Development of New Batch-Type Plasma Assisted NOR (Native-Oxide-Removal) Dry Cleaning Equipment
Wan Sik Kim, Wan Goo Hwang, Il-Kyoung Kim, Ki-Young Yun, Kwang Myung Lee, Seung Ki Chae |
p63 |
|
Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication
Gyu Hyun Kim, Geun Min Choi, Young Wook Song |
p67 |
|
Surfactionated Rinse against Pattern Collapse and Defectivity in 193nm Lithography
S.I. Misat, G.G. Grozev, J.J. Versluijs |
p71 |
|
Performance of a Linear Single Wafer IPA Vapour Based Drying System
Wim Fyen, Sophia Arnauts, Frank Holsteyns, G. Doumen, Guy Vereecke, Jan Van Steenbergen, Paul W. Mertens |
p75 |
|
Effective Rinse Aiming at Water-Mark-Free Drying for Single-Spin Wet Cleaning Process
Katsuhiko Miya, Takuya Kishimoto, Akira Izumi |
p79 |
|
Insights into Watermark Formation and Control
Hiromitsu Namba, Takehiko Orii, Hiroki Ohno, Glenn W. Gale |
p83 |
