A Novel Instrumentation for Contamination and Deposition Control on 300 mm Silicon Wafers Employing Synchrotron Radiation Based TXRF and EDXRF Analysis
Burkhard Beckhoff, R. Fliegauf, J. Weser, Gerhard Ulm |
p89 |
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Relation between Surface Contamination of Metals and Defect Formation in Si during Oxidation of Bulk- and SOI-Wafers
Ingrid Rink, A. De Veirman, A.J. Janssen |
p93 |
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Evaluation of Ultratrace Metallic Elements in Poly-SiGe Thin Films
Yuji Yamada, Shoji Kozuka, Ayako Shimazaki, Miyuki Takenaka |
p97 |
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Effect of Additives on the Removal Efficiency of Photoresist by Ozone/DI-Water Processes: Experimental Study
H. Vankerckhoven, F. De Smedt, M. Claes, Stefan De Gendt, Marc M. Heyns, Chris Vinckier |
p101 |
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Organic Contamination: Purge Gas Impact in Plastic Storage Boxes
Marc Veillerot, Adrien Danel, S. Marthon, F. Tardif |
p105 |
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Formation of Time-Dependent Haze on Silicon Wafers
N. Münter, Bernd O. Kolbesen, W. Storm, Timo Müller |
p109 |
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Compatibility of Supercritical Co2-Based Stripping with Porous Ultra Low-k Materials and Copper
C. Millet, Adrien Danel, M. Ndour, F. Tardif |
p113 |
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BEOL Post Ash Residue Removal Using DSP* Chemistry in an FSI Batch Spray Tool
René Vroom, Georg Gogg, Jerry O'Dwyer |
p117 |
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Backside Cleaning for Copper Removal
Claire Therese Richard, F. Guyader, Kathy Barla |
p121 |
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Evaluation of Organic Contamination on Si Wafers in Fab Environments
Joong S. Jeon, Colman Wong, Susanne Ohsiek, Hyeon S. Kim, Bob Ogle |
p125 |
