Defects and Contamination in Microelectronic Device Production: State-of-the-Art and Prospects
Bernd O. Kolbesen, Hans Cerva, G. Zoth |
p1 |
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The Effect of Ion Implantation on the Metal Contamination of Silicon Surfaces in Aqueous Solution
Lee M. Loewenstein, Paul W. Mertens, Marc M. Heyns |
p7 |
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Barium, Strontium and Bismuth Contamination in CMOS Processes
H. Boubekeur, T. Mikolajick, J. Höpfner, C. Dehm, W. Pamler, J. Steiner, G. Kilian, Bernd O. Kolbesen, Anton J. Bauer, Lothar Frey, Heiner Ryssel |
p9 |
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An Exploration on the Bridge Formation Mechanism of Cylindrical Storage Poly-Silicon by Water Marks in High Performance 4Gigabit DRAM Capacitor
Kun Tack Lee, Woo Gwan Shim, Hyung Ho Ko, Ho Young Kim, Yong Pil Han, Sang Rok Hah, Joo Tae Moon |
p15 |
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Chemical Processing and Materials Compatibility of High-K Dielectric Materials for Advanced Gate Stacks
J.J. Guan, Glenn W. Gale, G. Bersuker, M. Jackson, Howard R. Huff |
p19 |
|
Wettability Modification of Polysilicon for Stiction Reduction in Silicon Based Micro-electromechanical Structures
Angeles Marcia Almanza-Workman, Srini Raghavan, Pierre Deymier, David J. Monk, Ray Roop |
p23 |
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Dual Gate Oxide for 0.18μm Technologies and Below: Optimization of the Wet Processing Sequence
Didier Lévy, Sébastien Petitdidier, H. Bernard, F. Guyader, C. Dezauzier, C. Pizzetti |
p27 |
|
New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals
D.L. Rath, R. Ravikumar, D.J. Delehanty, R.G. Filippi, E.W. Kiewra, G. Stojakovic, K.J. McCullough, D.D. Miura, B.N. Rhoads |
p31 |
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Metal Wet Cleaning with No Corrosion: A Novel Approach
Francesco Pipia, Geun Min Choi, Tadahiro Ohmi |
p35 |
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Non-Contact Post Cu CMP Cleaning Using Megasonic Energy
Wim Fyen, Jeffrey M. Lauerhaas, Ingrid Vos, Marc Meuris, Paul W. Mertens, Marc M. Heyns |
p39 |
