Pre-Diffusion Cleaning Using Ozone and HF
Eric J. Bergman, Sebastien Lagrange, Martine Claes, Stefan De Gendt, Erika Röhr |
p85 |
|
Novel Back Side Processes for Copper and Pre-Lithography Cleans
Brian Aegerter, Sebastien Lagrange, Curt Dundas, Patrick Van Doorne |
p89 |
|
Optimisations of SC-1 Conditions for Sub 0.18μm Technologies in an Industrial Environment
Sébastien Petitdidier, H. Bernard, Enrico Bellandi, F. Landa, H. Shirakawa, Didier Lévy |
p93 |
|
Reduced Water Consumption for Post Clean Treatment and Metal Ion Contamination on VLSI Structures
Robert Small, Zhe Fei Chen, Cherry Wang, Becky Hon |
p97 |
|
Post SiN Etching Cleaning During Copper and Low K Integration
Alessio Beverina, Didier Louis, C. Arvet, E. Lajoinie, Pascal Besson, C. Peyne, Douglas Holmes, D. Maloney, S. Lee, W.M. Lee |
p101 |
|
Wet Preparation of Defect-Free Hydrogen-Terminated Silicon Wafer Surface and Its Characterization in Atomic-Scale
Takayuki Takahagi, Shozo Shingubara, Hiroyuki Sakaue |
p105 |
|
Detection and Identification of Organic Contamination on Silicon Substrates
A. Roche, S. Marthon, J.F. Ple, Névine Rochat, Adrien Danel, M. Olivier, M. Juhel, F. Tardif |
p111 |
|
Preparation and Characterization of Time Dependent Haze on Silicon Surfaces
N. Münter, Bernd O. Kolbesen, W. Storm, Timo Müller |
p115 |
|
Single Chemistry Cleaning Solution for Advanced Wafer Cleaning
Rita Vos, O. Doll, A. Fester, Bernd O. Kolbesen, Marcel Lux, Karine Kenis, Bart Onsia, S. Degendt, E. Schellkes, Z. Hatcher, Paul W. Mertens, Marc M. Heyns |
p119 |
|
Behaviors of Metallic Contaminants in Si Wafer Processing
Joong S. Jeon, Stefan De Gendt, Srini Raghavan, Marcia Almanza-Workman, Cynthia Gonsalves, Bob Ogle |
p123 |
