The Rinsing Problem: Effect of Solute-Surface Interactions on Wafer Purity
Lee M. Loewenstein, Paul W. Mertens |
p1 |
|
Hydrogenated Ultrapure Water Production System for Future Wet Cleaning Process
Hiroshi Morita, Jun ichi Ida, T. Mizuniwa, Tadahiro Ohmi |
p7 |
|
Behaviour of Metallic Contaminants during Mos Processing
Twan Bearda, Stefan De Gendt, Lee M. Loewenstein, M. Knotter, Paul W. Mertens, Marc M. Heyns |
p11 |
|
Hydrogen Peroxide Decomposition in Ammonia Solutions
D. Martin Knotter, Stefan De Gendt, M. Baeyens, Paul W. Mertens, Marc M. Heyns |
p15 |
|
New Aspects of the Diluted Dynamic Clean Process
F. Tardif, T. Lardin, A. Maciejny, Adrien Danel, Pieter Boelen, C. Cowache, Ismail Kashkoush, R. Novak |
p19 |
|
Single Step Alkaline Cleaning Solution for Advanced Semiconductor Cleaning
M. Baeyens, W. Hub, Bernd O. Kolbesen, A.R. Martin, Paul W. Mertens |
p23 |
|
Particle Removal Efficiency and Silicon Roughness in HF-DIW/O3/Megasonics Cleaning
Mauro Alessandri, Enrico Bellandi, Francesco Pipia, F. Cazzaniga, K. Wolke, M. Schenkl |
p27 |
|
Industrial Trends in Wet Processing Technology
L.F.Tz. Kwakman, M. Geomini, Didier Lévy, D. Malgouyres |
p31 |
|
Particle Addition Behaviour of Oxide Stripping by HF Solutions
Enrico Bellandi, Mauro Alessandri, Francesco Pipia, A. Tonti |
p35 |
|
The Electrochemical Kinetics of Silicon Surface Corrosion in HF Containing Dilute Solutions
V. Bertagna, F. Rouelle, R. Erre, M. Chemla |
p39 |
