Post Dry-Etch Cleaning Issues of an Organic Low-K Dielectric
F. Lanckmans, Mikhail R. Baklanov, C. Alaerts, Serge Vanhaelemeersch, Karen Maex
|
p89 |
Vapor Phase Decomposition - Droplet Collection: Can we Improve the Collection Efficiency for Copper Contamination?
Stefan De Gendt, A. Huber, Bart Onsia, Sophia Arnauts, Karine Kenis, D. Martin Knotter, Paul W. Mertens, Marc M. Heyns
|
p93 |
Characterization of the Post Dry Etch Cleaning of the Silicon Surface Prior to Silicon Epitaxial Growth
Y.B. Kim, Matty Caymax, H. Bender, Serge Vanhaelemeersch
|
p97 |
Silicon Contamination Prevention in HF Mixtures
V. Bertagna, F. Rouelle, R. Erre, M. Chemla
|
p101 |
Applications of Tetramethylammoninium Hydroxide (TMAH) as a Post Tungsten CMP Cleaning Mixture
M. Jolley
|
p105 |
Fe and Cu Removal Efficiency in HF-DIW/O3 Cleaning Sequence
Francesco Pipia, Enrico Bellandi, Barbara Crivelli, Mauro Alessandri
|
p109 |
Post Polysilicon Etch (Incorporating DUV Resist an BARC) Polymer Cleaning
Simon Y.M. Chooi, Ping-Yu Ee, B.-M. Seah, Mei Sheng Zhou
|
p113 |
Determination of Moisture / Water in Semiconductor Processing Liquids On-Line with the SemiChem Process Analyzer
J.H. Evans-Freeman, G. Frank, P.M. Robertson
|
p117 |
Evaluation of Cleaning Recipes Based on Ozonated Water for Pre-Gate Oxide Cleaning
Joong S. Jeon, Bob Ogle, M. Baeyens, Paul W. Mertens
|
p119 |
Characterization of Emitter Interface Oxide Growth in a Vertical LPCVD Polysilicon Deposition Reactor
M. Ramin, C. Hechtl, A. Haeusler
|
p123 |