Thermosets Toughening by Creation of Residual Compressive Stresses
Ho Sung Kim, Nam Ho Kim
|
p3 |
Finite-Element-Simulation of Interfacial Crack Propagation: Cross-Check of Simulation Results with the Essential Work of Interfacial Fracture Method
T. Schüller, B. Lauke
|
p9 |
Mechanical and Fracture Properties of Bamboo
I.M. Low, Z.Y. Che, Bruno A. Latella, K.S. Sim
|
p15 |
A Thermodynamic Approach to Long-Term Deformation and Damage for Polymeric Materials in Hygrothermal Environment
Xiao Hong Chen, Su Su Wang
|
p21 |
Advances in Three-Dimensional Fracture Mechanics
Wan Lin Guo, Chongmin She, Jun Hua Zhao, Bin Zhang
|
p27 |
Thermal Effects of Cracked Piezoelectric Materials under Cycling Electric-Loading
Ning Ning Du, Shou Wen Yu
|
p35 |
Near-Tip Fields for Penny-Shaped Cracks in Magnetoelectroelastic Media
Bao Lin Wang, Yiu Wing Mai
|
p41 |
Functionally Graded Materials with Periodic Cracks Subjected to Transient Loading
Jie Cai Han, Bao Lin Wang
|
p47 |
Numerical Study on Two-Dimensional Crack Problems in Three-Layered Isotropic Elastic Materials
Xi Zhang, Rob Jeffrey
|
p53 |
Notch Effects in Tensile Behavior of AM60 Magnesium Alloys
Cheng Yan, W. Ma, V. Burg, Yiu Wing Mai, M.G.D. Geers
|
p59 |