Chip Formation Behaviour in Ultra-Precision Cutting of Electroless Nickel Plated Mold Substrates
Ji Wang Yan, Takeo Sasaki, Junichi Tamaki, Akihiko Kubo, T. Sugino |
p3 |
|
A Controlled Atmosphere Cutting Apparatus for Understanding Tribological Behavior of Lubricants in Near-Dry Machining
K. Hayashi, I. Inasaki, Toshiaki Wakabayashi, Satoshi Suda, Shinya Suzuki, H. Yokota, Tomohiro Aoyama, M. Nakamura |
p9 |
|
Brittle-Ductile Transition in Nano Bending of Monocrystalline Silicon Carbide Analyzed by Molecular Dynamics Simulation
Hiroaki Tanaka, M. Sano, Shiro Shimada |
p15 |
|
Molecular Dynamics Analysis of Ultra High-Acceleration and Vibration Cutting
Jun Shimizu, H. Tanaka, Lian Zhou, Hiroshi Eda |
p21 |
|
Abrasive Nanometric Machining: Modelling, Simulation and its Application Promise
X.C. Luo, K. Cheng |
p27 |
|
A Study of the Molecular Dynamics Simulation in Nanometric Grinding
Ren Ke Kang, X.G. Guo, Dong Ming Guo, Zhu Ji Jin |
p33 |
|
Measurement and Analysis of AFM-Based Nano-Indentation on Micro-Machined Silicon Surface
Qing Liang Zhao, Ming Jun Chen, Ying Chun Liang, Shen Dong, K. Cheng |
p39 |
|
A Novel FEA Model for the Integral Analysis of a Machine Tool and Machining Processes
D. Huo, K. Cheng, D. Webb, F. Wardle |
p45 |
|
Influence of the Static Stiffness of Grinding System on the Generation of Affected Layers
S. Yokoyama, Hwa Soo Lee, T. Yamada |
p51 |
|
Geometric Models of the Ultra-Precision Grinding for Large Non-Axisymmetric Optical Aspheric Surfaces
Cheng Shun Han, Shen Dong, Y.Y. Tang |
p57 |
