Lead-Free Layered Perovskite Film Capacitor for Ferroelectric Random Access Memory
Uong Chon, Jeong Seob Shim, Hyun M. Jang |
p1 |
|
Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints
K.S. Kim, Katsuaki Suganuma, Toshitada Shimozaki, C.G. Lee |
p7 |
|
Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability
Jong Min Kim, Young Eui Shin, Kozo Fujimoto |
p12 |
|
Application of Lead-Free Glass to Barrier Rib Materials in Plasma Display Panel
Hyung Sun Kim, Byung Hae Jung |
p18 |
|
Joining and Processing in Engineering Ceramics to Metallic Materials, in Biomorphic SiC Ceramics, and in Bioactive and Bioinert Ceramics
J. Ernesto Indacochea |
p23 |
|
Biocompatibility of Plasma-Sprayed Biomedical Coatings
Chuan Xian Ding, Xuan Yong Liu, Xue Bin Zheng |
p30 |
|
TiO2-Coated Plastic Optical Fibers for Purification
Hong Dae Shin, Hyun Ku Joo |
p34 |
|
Porosity Variation on the Compressive Deformation of Pre-Sintered Al-Si-Fe Based Alloy
Gyu-Sam Shim, Mok Soon Kim, Won Yong Kim, Hiroshi Yamagata |
p40 |
|
Mechanical Characteristics of Mg and its Composites Recycled from Mg Chips
Si Young Chang, Jin Chun Kim, Seung Kyun Ryu, Sung Tag Oh, Kae Myung Kang |
p46 |
|
Viscosity and Surface Tension of Al and Effects of Additional Element
Bo Young Hur, Soo Han Park, Arai Hiroshi |
p51 |
