Chemical Mechanical Polishing (CMP) in Magnetic Float Polishing (MFP) of Advanced Ceramic (Silicon Nitride) and Glass (Silicon Dioxide)
M. Jiang, R. Komanduri |
p1 |
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Fuzzy Contact and Its Effect on Thermal Damage in Grinding Processes
H.S. Qi, W.B. Rowe, B. Mills |
p15 |
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Bifractal Characteristics of Ground Workpiece Surfaces
S.F. Lu, Y. Gao, Z. Li |
p25 |
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Wear Pattern of Coated Carbide Tools in High Speed Threading of a Ni-Cr-Mo Base Steel
Emmanuel O. Ezugwu, C.I. Okeke |
p29 |
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A Study on Surface Quality of Ultraprecision Grinding for Engineering Ceramics
S.Y. Yu, X.S. Han, Bin Lin |
p35 |
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A Complex Thermal Model for Deep Grinding
Guang Qi Cai, Tao Jin, B.F. Feng |
p41 |
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A Study of Turning Operation by Oil-Water Combined Mist Lubrication Machining Method
D.C. Chen, Y. Suzuki, Kazufumi Sakai |
p47 |
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Research on Enhancing Heat Transfer in Grinding Contact Zone with Radial Water Jet Impinging Cooling
Hong Jun Xu, Yu Can Fu, Fang Hong Sun |
p53 |
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Significance of Grinding Temperature in Metal Removal
Dun Wen Zuo, T. Matsuo |
p57 |
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Stone Sawing Forces by Single Diamond Segment
Cheng Yong Wang, R. Clausen |
p61 |
