Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor
Hong Ho Cheng, H.Y. Tsai, Yue Long Huang |
p1 |
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A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process
Junji Watanabe, R. Etoh, M. Hirano |
p25 |
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Some Essentials of Simulating Nano-Surfacing Processes Using the Molecular Dynamics Method
Wun Chet Davy Cheong, Liang Chi Zhang, Hiroaki Tanaka |
p31 |
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Assessment of the Exit Defects in Carbon Fibre-Reinforced Plastic Plates Caused by Drilling
Hou Jiang Zhang, Wu Yi Chen, Ding Chang Chen, Liang Chi Zhang |
p43 |
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Grinding of Ceramics: Strength, Surface Features and Grinding Conditions
Tian Shu Liu, Bruno A. Latella, Liang Chi Zhang |
p53 |
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Grinding Burn Mechanism of Directionally Solidified Superalloy
Ming Chen, Fang Hong Sun, Bing Yuan Xue |
p61 |
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Wear Mechanism of Diamond Cutting Tool in Machining of Steel
Hiroaki Tanaka, Shoich Shimada, Naoya Ikawa, M. Yoshinaga |
p69 |
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A Friction Model for Free-Machining Steels and Its Applicability to Machinability Analysis
K. Maekawa, Akihiko Kubo, T.H.C. Childs |
p79 |
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Improvement of Friction and Wear Properties of CVD-SiC Films with New Surface Finishing Method 'ELID-Grinding'
T. Kato, Hitoshi Ohmori, C. Zhang, T. Yamazaki, Y. Akune, K. Hokkirigawa |
p91 |
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A New Device of Abrasive Jet Machining and Application to Abrasive Jet Printer
Tsunemoto Kuriyagawa, Takashi Sakuyama, Katsuo Syoji, Hiromitsu Onodera |
p103 |
