PECVD of Silicon Dioxide from TEOS/Oxygen Mixtures
T.S. Cale, G.B. Raupp |
p1 |
|
Analysis and Design of Plasma Chemical Reactions Based on Quantum Chemical Methods
K. Sato |
p17 |
|
Advanced Simulation of Dry Etching Process Technology
J. Pelka |
p25 |
|
Anisotropic ECR Plasma Etching with Low-Energy Ions
Y. Tobinaga, T. Miyano, K. Fujimoto, M. Fujito, H. Fujiwara |
p39 |
|
High-Rate Sputtering with Electron Cyclotron Resonance and Electric-Mirror Excitation
Masaya Matsuoka |
p55 |
|
Modified ECR Plasma Deposition
S. Nakamura, Toshikazu Akahori, Satoshi Nakayama |
p79 |
|
DC Saddle-Field Plasma-Enhanced Vapour Deposition
R.V. Kruzelecky, S. Zukotynski |
p89 |
|
Theoretical Characterization of Electron Energy Distribution Function in RF Plasmas
M. Capitelli, G. Capriati, M. Dilonardo, C. Gorse, S. Longo |
p107 |
|
Ion Energy Distributions and Sidewall Profiles in Reactive Ion Etching
Paul W. May, David P. Field, D.F. Klemperer, Y.P. Song |
p121 |
|
Dissipative Structures and Nonequilibrium Phenomena in Plasma-Surface Interaction
Y.L. Khait |
p133 |
