| ISBN / ISBN-13: | 0-87849-670-x / 978-0-87849-670-9 |
|---|---|
| Year: | 1993 |
| Title: | Plasma Properties, Deposition and Etching [online] |
| Authors/Editors: | J. J. Pouch and S. A. Alterovitz |
| Published in: | Materials Science Forum, Volumes 140 - 142 |
| Category: | |
| Pages: | 749 |
| Edition: | |
| Description: | Containing 42 invited papers, this fine book covers a broad range of subjects on plasmas and applications In the first section, plasma properties and methods used to characterize the plasma are addressed. Many of these papers also cover deposition or etching of particular materials. The second part focuses on the application of various plasma techniques used to deposit thin films, and on the resulting film properties. Finally, the application of plasma etching to the fabrication of silicon-based circuits, plasma etching of III-V compound semiconductors and other processing applications are discussed in the third and last section. Plasma Properties, Deposition and Etching summarizes results obtained to date and is felt to provide a good basis for further development in the area. 1. Plasma Properties and Diagnostics. 2. Plasma Deposition. 3. Plasma Etching and Processing. |
| TOC: | Table of Contents |
| Prices: | USD: 367.00 / EUR: 266.00 |
