The Importance of Residual Stresses in Microelectronic Products and Materials
Wolfgang H. Müller
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p1 |
An X-Ray Diffraction Method to Determine Stress at Constant Penetration/Information Depth
A. Kumar, U. Welzel, M. Wohlschlögel, W. Baumann, Eric J. Mittemeijer
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p13 |
Mechanical Stress Gradients in Thin Films Analyzed Employing X-Ray Diffraction Measurements at Constant Penetration/Information Depths
M. Wohlschlögel, W. Baumann, U. Welzel, Eric J. Mittemeijer
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p19 |
Sub-Surface Residual Stress Gradients: Advances in Laboratory XRD Methods
Cristy Leonor Azanza Ricardo, Mirco D'Incau, Paolo Scardi
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p25 |
Determination of Real Space Residual Stress Distributions σij(z) of Surface Treated Materials with Diffraction Methods Part I: Angle-Dispersive Approach
Thorsten Manns, Jens Gibmeier, Berthold Scholtes
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p31 |
Determination of Real Space Residual Stress Distributions σij(z) of Surface Treated Materials with Diffraction Methods Part II: Energy Dispersive Approach
Ingwer A. Denks, Manuela Klaus, Christoph Genzel
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p37 |
The Residual Stresses Generated by Deep Rolling and their Stability in Fatigue & Application to Deep-Rolled Crankshafts
H. Michaud, Jean Michel Sprauel, F. Galzy
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p45 |
Stability of Residual Stresses of Deep Rolled Sintered Iron at Quasistatic and Cyclic Loading
Jens Merkel, Volker Schulze, Alexander Wanner, Otmar Vöhringer
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p51 |
Residual Stress Stability in High Temperature Fatigued Mechanically Surface Treated Metallic Materials
I. Altenberger, Ivan Nikitin, P. Juijerm, Berthold Scholtes
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p57 |
Residual Stresses Induced by Cross-Rolling
Krzysztof Wierzbanowski, S. Wroński, Andrzej Baczmański, Mirosław Wróbel, Chedly Braham, Michael E. Fitzpatrick, Alain Lodini
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p63 |