Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone
Z. Shi, Madhusudhan Srinivasaraghavan, Helmi Attia |
p1 |
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Study on the Subsurface Damage of Single Crystal MgO Substrates
Zhi Gang Dong, Ren Ke Kang, Zhen Yuan Jia |
p7 |
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Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer
J. Sasaki, T. Tsuruga, B.H. Soltani, Takahito Mitsuta, Y.B. Tian, Jun Shimizu, Li Bo Zhou, Hiroshi Eda, Y. Tashiro, Hisao Iwase, Sumio Kamiya |
p13 |
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Comparative Study on the Materials Removal Mechanism of Ceramics and Steels
Jian Qiang Guo, Hitoshi Ohmori, Kazutoshi Katahira, Yoshihiro Uehara |
p18 |
|
Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters
H.P. Yuan, Hang Gao, Yong Jie Bao, Yong Bo Wu |
p24 |
|
Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool
Junichi Tamaki, Akihiko Kubo, Ji Wang Yan |
p30 |
|
Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
Feng Wei Huo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin |
p36 |
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Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding
Yoshio Ichida, Ryunosuke Sato, Masakazu Fujimoto, Nabil Ben Fredj |
p42 |
|
Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model
Taisei Yamada, Hwa Soo Lee |
p48 |
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Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB
Hiroshi Nojiri, Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsuyoshi Otsuka |
p55 |
