The Effect of the Magnetic Field’s Direction to Polishing in a Magnetic-Electrochemical Compound Polishing
Li Min Shi, Yong Jiang Niu, Er Liang Liu, Yong Feng Ma |
p1 |
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Belt Grinding of TC4 Based on the Technology of Cryogenic Mist Jet Combined MQL
Yu Fu Wang, Yun Huang, Zhi Huang, Liang Yi |
p8 |
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Experimental Study on Point Grinding Technical Parameters Affecting Coolant Jet Parameters
Shi Chao Xiu, Zhi Jie Geng, Peng Bo Xiu |
p13 |
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Experimental Study on Ultra-Precision ELID Grinding for Concave Spherical Surface of Carbide
Fu Qiang Tong, Yong Zhang, Fei Hu Zhang |
p18 |
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Studies on the Grinding Properties of Ultrasonic Assisted Creep Feed Grinding Using Grinding Wheel with Small Diameter
Jian Xin Zheng, Jia Wen Xu, Chuan Shao Liu |
p23 |
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Temperature Field during CMP GaAs Wafer Using an AID
Wen Zhuang Lu, Dun Wen Zuo, Yu Li Sun, Yu Fei Zhao, Feng Xu, Rong Fa Chen |
p28 |
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Design and Research of Embedded Internal Grinding NC System Based on μC/OS-II
Ou Xie, Hua Li, Yan Li |
p34 |
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Experimental Study on High Efficiency Grinding Technology for Irregular Surface of Q.L. Red Granite
Zheng Mei Zhang, Jin Sheng Zhang, Zhi Wang, Chun Ying Zheng |
p40 |
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Fatigue Life Variance Prediction Incorporating Residual Stress Scatter Induced by Super-Finishing Grinding Process
Guang Hui Lu, Xue Ping Zhang, Er Wei Gao |
p45 |
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Analysis of Grinding Force Influence on HIPSN Ceramic Grinding Surface
Ke Zhang, He Wang, Yu Hou Wu, Song Hua Li |
p51 |
